Computer having cooling apparatus and heat exchanging device of the cooling apparatus

ABSTRACT

A computer having a cooling apparatus and a heat exchanging device of the cooling apparatus are provided. The cooling apparatus includes a heat exchanging device for absorbing heat from heat-producing components. A passageway is provided in the heat exchanging device and a liquid coolant circulates through the passageway. A heat dissipation device has a liquid coolant reservoir having radiating fins provided on its surface. The heat exchanging device and the reservoir are connected by a first conduit and a second conduit. The liquid coolant circulates from the heat dissipation device to the heat exchanging device and back to the heat dissipation device by means of a pump. The heat dissipation device is separated from an interior space of the computer by a separating wall for isolating the heat-producing components from the flow of ambient air. The flow of ambient air passing through the radiating fins for exhausting heat from the liquid coolant can be produced by natural convection or forcibly produced by a fan.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation-in-part application of U.S.Pat. No. 09/572,282, filed on May 25, 2000, which is herein incorporatedby reference in its entirety.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a computer having a coolingapparatus and a heat exchanging device of the cooling apparatus, andmore particularly, to a computer having a cooling apparatus having animproved cooling capacity and configured to prevent contamination due toflow of ambient air, and a heat exchanging device used for the coolingapparatus.

[0004] 2. Description of the Related Art

[0005] It is known well that electronic devices including computersgenerally have heat-producing components. Various types of coolingsystems have been proposed for removing heat from the heat-producingcomponents to maintain the electronic device within operatingtemperature limits. Although there are various devices includinghydrocooling systems, air cooling systems and systems that employgaseous and liquid coolants, the most typically used systems are forcedair cooling systems using fans.

[0006] However, the conventional apparatuses have many drawbacks. One ofthe drawbacks is lack of cooling capacity. Recently, according to rapiddevelopment of electronics industry, components of the electronicdevices have become highly integrated and heat-producing densities arealso increasing. Accordingly, existing air cooling systems havelimitations in solving problem of heat production in spite of continuedimprovement of cooling fan performance. Also, efforts to increasecooling capacity result in bulkiness and complexity of cooling systems.

[0007] In addition to the insufficient cooling capacity, anotherdrawback of the conventional air cooling systems includes noise due touse of fans. As the modern society becomes advanced, the workingconditions of people are inseparable from computers or variouselectronic devices and people are getting highly sensitive to ambientnoise. Therefore, it is important to offer quiet working surroundings topeople who concentrate on various kinds of business in a closed workingspace.

[0008] A third problem is contamination of a computer, caused by a fanfor inducing air flow to cool heat-producing components of a computer orcomponents of a cooling apparatus, e.g., radiators. Use of a fan fordissipating the heat generated inside a computer may cause external air,dust or other contaminants to be induced inside the computer. Theinduced dust or other contaminants may contaminate electronic componentsto cause damage thereto, and may be collected inside the computer toobstruct air flow, resulting in deteriorated cooling efficiency.

[0009] Nevertheless, expensive industrial computers operating underinferior working conditions cannot be isolated from working spacesbecause of cooling, so that they are forcibly exposed to the inferiorworking conditions. Thus, the life spans of the expensive computers maybe shortened or defects thereof may increase.

SUMMARY OF THE INVENTION

[0010] To solve the above problems encountered with the prior art, it isan object of the present invention to provide a computer having acooling apparatus which has improved cooling capacity and in which a fanand heat radiating fins are isolated from heat-producing components toprevent contamination due to flow of ambient air, and a heat exchangingdevice used in the cooling apparatus for cooling the heat-producingcomponents.

[0011] The present invention provides a computer having a housingdefining an interior space and at least one heat-producing componentsinstalled inside the housing, the computer comprising a coolingapparatus for cooling the heat-producing components.

[0012] The computer according to the present invention includes a heatexchanging device in heat exchangeably contact with the heat-producingcomponent and having a passageway extending between an inlet port and anoutlet port, a heat dissipation device having a reservoir for storing aliquid coolant having an inlet opening and an outlet opening spaced apredetermined distance apart from the inlet opening, and a plurality ofradiating fins installed on the outer surface of the reservoir so as tobe capable of exchanging heat with the reservoir, a first conduitextending between the outlet port of the heat exchanging device and theinlet opening of the reservoir, a second conduit extending between theoutlet opening of the reservoir and the inlet port of the heatexchanging device, a pump for pumping the liquid coolant out of thereservoir through the outlet opening, through the second conduit, thepassageway and the first conduit, and back into the reservoir throughthe inlet opening, and a separating wall separating the heat dissipationdevice from the interior space to isolate the heat-producing componentfrom the flow of ambient air

[0013] The cooling apparatus provided in the computer according to thepresent invention can be used in various types of computers. In thefirst embodiment of the present invention, the cooling apparatus is usedin a personal computer having a tower case. The heat dissipation deviceis mounted inside a subhousing installed on the bottom wall of the towercase. The heat dissipation device may be installed in the interior spaceformed between either the bottom wall or the side wall of the tower caseand the separating wall by the separating wall installed inside thetower case.

[0014] In the second embodiment of the present invention, the computeris used in an industrial computer having a housing in the form of a rackmounting case. In the side wall of the case, an inlet vent and an outletvent are formed at side walls of the case to be spaced apart from eachother, and the opposite ends of the heat dissipation device arepositioned adjacent to the inlet vent and the outlet vent. Thisarrangement of the inlet and outlet vents can prevent the flow of airfrom being shielded by adjacent computers installed on racks stacked inmultiple layers.

[0015] Also, the cooling apparatus provided in the computer according tothe present invention may further include a fan. The fan is disposedadjacent to one end of the heat dissipation device and in communicationwith ambient air, and compels the ambient air to flow through theradiating fins to exhaust the heat from the liquid coolant stored in thereservoir, the fan being isolated from the interior space by theseparating wall.

[0016] Alternatively, the present invention also provides heatexchanging devices for cooling heat-producing components of a computer.The heat-producing components have various types and the heat exchangingdevices also have various types accordingly. In other words, the heatexchanging devices used to cool a power supply, a hard drive, a CPUI anda memory have configurations and types corresponding to each type.

[0017] The present invention provides a cooling apparatus which canovercome drawbacks of the conventional cooling apparatus and can coolheat-producing components thereof effectively and reliably and acomputer including the cooling apparatus. According to the presentinvention, while protecting the heat-producing components fromcontamination due to flow of and contact with ambient air, theheat-producing components can be effectively cooled by a water-coolingmethod using a cooling liquid.

[0018] In order to dissipate heat from the cooling liquid, the flow ofambient air passing through heat-radiating fins may be formed by naturalconvection or may be forcibly formed by a fan. The fan provided in thecooling apparatus can be controlled to operate with rated power orbelow. Even if the fan is operated with the rated power or below, it isdesigned to have a sufficient cooling capacity. If the fan is operatedwith the rated power or below, e.g., with 70% of the rated power, only asmall amount of noise is generated, compared with the case when the fanis operated at 100% of the rated power. This level of noise is barelyperceptible under ordinary office circumstances, providing agreeableworking surroundings. Also, if the fan is operated with 70% of the ratedpower, the life span of the fan is greatly prolonged, thereby reducingthe generation of objectionable noise due to wear of the fan andextending the replacement cycle of the fan. However, in hot summer orunder extremely inferior circumstances, in order to maximize the coolingcapacity, the fan may be operated with full rated power. To this end, atemperature sensor may be provided. The temperature sensor canautomatically control the speed of the fan according to the temperatureof heat-producing components.

[0019] The apparatuses according to the present invention are relativelysimplified and can be standardized in view of type and size so as to beeasily applied to various types of computers.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above object and advantages of the present invention willbecome more apparent by describing in detail preferred embodimentsthereof with reference to the attached drawings in which:

[0021]FIGS. 1A and 1B are perspective views of the outer appearance apersonal computer having a cooling apparatus according to a firstembodiment of the present invention, respectively viewed front and rearsides thereof;

[0022]FIG. 2 is a schematic diagram of the structure of the coolingapparatus shown in FIGS. 1A and 1B;

[0023]FIGS. 3A through 3C are partly cut-away perspective views of apersonal computer in which a heat dissipation device is provided insidea tower case, viewed from a front side thereof, unlike in FIGS. 1A and1B;

[0024]FIG. 4A is a perspective view of the outer appearance of a heatdissipation device shown in FIG. 2, FIG. 4B is a cross-sectional view ofthe heat dissipation device shown in FIG. 4A, taken along line A-A, andFIG. 4C is a cross-sectional view of the heat dissipation device shownin FIG. 4A, taken along line B-B;

[0025]FIGS. 5A and 5B are a partly cut-away perspective view and anelevational view of a heat exchanging device according to an embodimentof the present invention for use in a power supply, respectively;

[0026]FIG. 6 is a partially exploded perspective view of a heatexchanging device according to another embodiment of the presentinvention for use in a power supply;

[0027]FIG. 7A is a partly cross-sectioned elevational view of a heatexchanging device according to still another embodiment of the presentinvention for use in a power supply, and FIG. 7B is a partly cut-awayperspective view of a heat exchanging device according to still yetanother embodiment of the present invention for use in a power supply;

[0028]FIG. 8 is an exploded perspective view of a heat exchanging deviceaccording to an embodiment of the present invention for use in a harddrive;

[0029]FIG. 9 is an exploded perspective view of a heat exchanging deviceaccording to another embodiment of the present invention for use in ahard drive;

[0030]FIG. 10 is a perspective view showing a state in which the heatexchanging device shown in FIG. 9 is installed in the hard drive;

[0031]FIG. 11 is an exploded perspective view of a heat exchangingdevice according to an embodiment of the present invention for use in aCPU;

[0032]FIG. 12 is a partially cross-sectional elevational view of theheat exchanging device shown in FIG. 11;

[0033]FIG. 13 is an exploded perspective view of a means for securelycontacting the heat exchanging device shown in FIG. 11 with a CPU;

[0034]FIGS. 14A and 14B are a perspective view and a partiallycross-sectional view showing the connected state of the securelycontacting means shown in FIG. 13;

[0035]FIG. 15 is an exploded perspective view of a heat exchangingdevice according to another means for securely contacting the heatexchanging device shown in FIG. 11 with a CPU;

[0036]FIGS. 16A and 16B are a perspective view and a partiallycross-sectional view showing the connected state of the securelycontacting means shown in FIG. 15;

[0037]FIG. 17 is an exploded perspective view of a heat exchangingdevice according to an embodiment of the present invention for use in amemory;

[0038]FIG. 18 is a perspective view showing a state in which the heatexchanging device shown in FIG. 17 is installed in the memory;

[0039]FIG. 19 is a perspective view of an industrial computer having acooling apparatus according to another embodiment of the presentinvention;

[0040]FIG. 20 is a perspective view of an industrial computer having acooling apparatus installed in a direction different from that of FIG.19;

[0041]FIG. 21 is a partly cut-away perspective view of a personalcomputer having a cooling apparatus according to still anotherembodiment of the present invention;

[0042]FIG. 22 is a schematic diagram of the structure of the coolingapparatus installed in the personal computer shown in FIG. 21; and

[0043]FIG. 23 is a fragmentary perspective view of a personal computerhaving a cooling apparatus according to still another embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

[0044] Preferred embodiment of the present invention will now bedescribed in more detail with reference to the accompanying drawings.

[0045]FIGS. 1A and 1B are perspective views of a personal computerhaving a cooling apparatus according to a first embodiment of thepresent invention, respectively viewed front and rear sides thereof, andFIG. 2 is a schematic diagram of the structure of the cooling apparatusshown in FIGS. 1A and 1B.

[0046] First, referring to FIGS. 1A and 1B, a personal computer 2 has ahousing in the form of a tower case 4. The tower case 4 includes a front8, an opposite back 10 and a bottom wall 12. A subhousing 14 isinstalled on the bottom wall 12 of the tower case 4. The subhousing 14itself has a bottom wall 16. Air inlet vents 18 are formed on the frontend of the subhousing 14, and air outlet vents 20 are formed in theopposite rear end. Arrows shown in FIGS. 1A and 1B indicate thedirections of the flow of air.

[0047] Referring to FIG. 2, the tower case 4 defines an interior space 6of the personal computer 2. A plurality of components are installed inthe interior space 6, that is, inside the tower case 4. These componentsare of various types and include a plurality of heat-producingcomponents. The components installed inside the tower case 4 include apower supply 22 and a hard drive 24. A mother board 26 is also installedinside the tower case 4. In general, a plurality of components areinstalled in the mother board 26. In FIG. 2, three components areinstalled in the mother board 26. These components are a CPU 28, amicroprocessor chip 30 and a memory 32. These three components 28, 30and 32, the power supply 22 and the hard drive 24 are heat-producingcomponents. Thus, as will be described below, a cooling apparatus forcooling these components is necessary.

[0048] In accordance with the present invention, a heat exchangingdevice having a passageway connected between an inlet and an outlet isinstalled in each heat-producing component. The passagewayheat-exchangeably contacts with the heat-producing components. Liquidcoolant C circulates through the passageway to carry heat away from thecomponents.

[0049] The cooling apparatus also includes a heat dissipation device 36.The heat dissipation device 36 is mounted in the subhousing 14 and has areservoir 38 for storing the liquid coolant C. The reservoir 38 ispreferably made from a heat conductive material, for example, aluminum.The reservoir 38 has an inlet opening 40 and an outlet opening 42 spacedfrom the inlet opening 40. A plurality of radiating fins 44 are mountedon the outer surface of the reservoir 38. The radiating fins 44 are inheat exchangeable contact with the outer surface of the reservoir 38.The radiating fins 44 can be integrally formed with or separately formedfrom the reservoir 38. The liquid coolant C circulates from thereservoir 38 to the heat exchanging device on the heat-producingcomponents and back to the reservoir 38. A first conduit 46 extends fromthe outlet port of the heat exchanging device to the inlet opening 40 ofthe reservoir 38. A second conduit 48 extends from the outlet opening 42and the inlet port of the heat exchanging device. As shown, the liquidcoolant C circulates through the passageways of the various heatexchanging devices for the heat-producing components in series. Theliquid coolant C moves from the reservoir 38 to the inside of the heatexchanging device for the hard drive 24 through the second conduit 48and then moves from the heat exchanging device for the hard drive 24 tothe heat exchanging device for the power supply 22. From the powersupply 22, the coolant C circulates consecutively through the heatexchanging devices for the memory 32, the microprocessor chip 30 and theCPU 28. From the outlet port of the heat exchanging device for the CPU28, the coolant C circulates back via the first conduit 46 to thereservoir 38 through the inlet opening 40. Small arrows shown in FIG. 2indicate circulation paths of the coolant C. Although the circulationpaths of the coolant C are disposed in series in FIG. 2, they may bedisposed in parallel or in combination of parallel and seriesarrangements according to the heat transfer amount of the heat-producingcomponents and installation locations thereof. A pump 52 for circulatingthe coolant C is installed inside the reservoir 38, as described above.

[0050] The important feature of the present invention lies in that theheat-producing components installed in the space 6 are isolated from theflow of ambient air. To provide such isolation, one or more separatingwalls for separating the heat dissipation device 36 from the interiorspace 6 are provided. In the embodiment shown in FIGS. 1A and 1B andFIG. 2, the bottom wall 12 of the tower case 4 functions as theseparating wall.

[0051] The cooling apparatus may further include a fan 50 installed inthe subhousing 14. The fan 50 is positioned adjacent to an end of theheat dissipation device 36 and is in communication with ambient airthrough the air outlet vent 20 of the subhousing 14. The fan 50 operatesto direct ambient air through the radiating fins 44 to dissipate heatfrom the liquid coolant C in the reservoir 38. The fan 50 is alsoseparated from the interior space 6 by the separating wall. Large arrowsshown in FIG. 2 indicate the directions of the flow of ambient air.FIGS. 3A through 3C show a personal computer having a heat dissipationdevice provided inside a tower case, unlike in FIGS. 1A and lB. FIG. 3Aillustrates an embodiment in which a heat dissipation device isinstalled adjacent to the bottom of a tower case, and FIGS. 3B and 3Cillustrate embodiments in which heat dissipation devices are installedon the side s of a tower case. Arrows shown in FIGS. 3A through 3Cindicate the directions of the flow of ambient air.

[0052] Referring to FIG. 3A, a separating wall 315 is installed inside atower case 304 of a personal computer 302 to be spaced apart from abottom wall 312 of the tower case 304. The heat dissipation device 36 isinstalled between the bottom wall 312 and the separating wall 315. Also,the fan 50 may be installed adjacent to one end of the heat dissipationdevice 36. An inlet vent 318 is provided adjacent to the other end ofthe dissipation device 36 in the lower portion of a front 308 of thetower case 304. Also, an outlet vent (not shown) is provided adjacent tothe fan 50 in the lower portion of the rear of the tower case 304. Inother words, the separating wall 315 is installed between theheat-producing components installed inside the interior space 306 andthe heat dissipation device 36. Thus, the heat-producing components canbe isolated from the flow of ambient air by the separating wall 315.Referring to FIG. 3B, a separating wall 415 is installed inside a towercase 404 of a personal computer 402 to be spaced apart from a side wall409 of the tower case 404. The heat dissipation device 36 is installedbetween the side wall 409 and the separating wall 415. Also, the fan 50may be installed adjacent to one end of the heat dissipation device 36.An inlet vent 418 is provided adjacent to the other end of the heatdissipation device 36 on the side wall 409 of the tower case 304. Also,an outlet vent (not shown) is provided adjacent to the fan 50 in theback of the tower case 304. The radiating fins 44 of the heatdissipation device 36 are preferably horizontally installed along thedirection of the flow of ambient air. Thus, the heat-producingcomponents installed in the interior space 406 can be isolated from theheat dissipation device 36 and the fan 50 by the separating wall 415.

[0053] Referring to FIG. 3C, a separating wall 515 is installed inside atower case 504 of a personal computer 502 to be spaced apart from a sidewall 509 of the tower case 504. The heat dissipation device 36 isinstalled between the side wall 509 and the separating wall 515. Aninlet vent 518 is provided adjacent to one end of the heat dissipationdevice 36 in the lower portion of the side wall 509. Also, an outletvent 520 is provided adjacent to the other end of the dissipation device36 in the upper portion of the side wall 509. The radiating fins 44 ofthe heating dissipation device 36 are preferably vertically installedalong the direction of the flow of ambient air. Thus, the heat-producingcomponents installed in the interior space 506 of the tower case 504 canbe isolated from the flow of ambient air by the separating wall 515. Inthis embodiment, a fan is not installed, unlike the above-describedembodiments. Thus, the flow of ambient air passing through the heattransfer fin s 44 is produced by natural convection. To this end, asdescribed above, the inlet vent 518 and the outlet vent 520 are disposedin the lower and upper portions of the side wall 509, respectively. Theair induced through the inlet vent 518 provided in the lower portion ofthe side wall 509 becomes warmer while passing through the radiatingfins 44, the warm air is elevated to then be exhausted to the outsidethrough the outlet vent 520 provided in the upper portion of the sidewall 509. If the flow of ambient air is produced by natural convectionrather than a fan, as described above, noise due to the use of the fanis not generated.

[0054] The heat dissipation device 36 will now be described in moredetail with reference to FIGS. 4A, 4B and 4C. Referring thereto, theheat dissipation device 36 has the reservoir 38 for storing the liquidcoolant C. The radiating fins 44 are installed on the outer surface ofthe reservoir 38. The fan 50 is disposed adjacent to one end of the heatdissipation device 36, and a pump 52 for circulating the liquid coolantC is installed inside the reservoir 38. An outlet opening 42 and aninlet opening 40 for exhausting and recovering the liquid coolant C, areprovided on the top portion of the reservoir 38. Also, an opening forrefilling/exhausting the liquid coolant C into/from the reservoir 38, isprovided at one side of the reservoir 38, and a thread 37 is tightenedwith the opening.

[0055] One or more divider walls 49 are installed inside the reservoir38. A selected divider wall 49 extends from one-end inner wall of thereservoir 38 and the end thereof is spaced from the other-end inner wallof the reservoir 38. The direction of the flow of the liquid coolant Cis inverted through the space between the end of the selected dividerwall 49 and the other-end inner wall of the reservoir 38. Anotherdivider wall adjacent to the selected divider wall 49 extends from theother-end inner wall of the reservoir 38. As described above, thedivider wall 49 elongates the path of the flow of the liquid coolant Cback into the reservoir 38 so that heat transfer from the liquid coolantC is sufficiently performed through the radiating fins 44. Arrows shownin FIG. 4C indicate the direction of the flow of the liquid coolant C.

[0056]FIG. 5A and 5B illustrate preferred embodiments of heat exchangingdevices for use in a power supply. Referring to FIGS. 5A and 5B, a heatexchanging device according to this embodiment includes a heat sink 58made of aluminum. The heat sink 58 may be integrally formed by adie-casting method. The heat sink 58 is mounted on a board 59. The powersupply 22 includes a plurality of heat-producing elements 60 and 61.These elements 60 and 61 are, for example, a transistor and/or atransformer. The elements 60 and 61 are mounted on the heat sink 58 andare in heat exchangeable contact with the heat sink 58. A channel 62 isprovided at each side of the heat sink 58. The pair of channels 62 areparallel to each other. A U-shaped conduit 64 is fitted into the channel62 and heat-exchangeably contacts with the heat sink 58. To this end, aheat bond is preferably interposed between the inner surface of thechannel 62 and the outer surface of the U-shaped conduit 64. Theopposite ends of the U-shaped conduit 64 form an inlet port 66 and anoutlet port 68 of the heat exchanging device. The U-shaped conduit 64functions as a circulation passageway of the liquid coolant of the heatexchanging device according to this embodiment. The liquid coolantcirculating through the passageway carries away heat from the heat sink58 to then be exhausted. Thus, the heat generated from the elements 60and 61 is exhausted.

[0057]FIG. 6 illustrates another embodiment of a heat exchanging devicefor use in a power supply. Referring to FIG. 6, the heat exchangingdevice according to this embodiment includes a heat sink 58′ made ofaluminum. The heat sink 58′ is divided into two parts. A heat pad 65 forpreventing leakage and transferring heat, is inserted between the twoparts and assembled. The power supply 22 includes a plurality ofheat-producing elements 60 and 61. The elements 60 and 61 are mounted onthe heat sink 58′. Of the elements 60 and 61, the element 61 installedin the middle of the heat sink 58′, for example, a transformer, is inheat exchangeably contact with the heat sink 58′ by a silicon heat bondmaterial. Also, the element 60 installed at the lateral side of the heatsink 58′, for example, a transistor, is in heat exchangeably contactwith the heat sink 58′. An interior passageway 63 through which theliquid coolant passes, is formed inside the heat sink 58′. Shortconduits 69 and 70 are fitted into the opposite ends of the interiorpassageway 63 to form an inlet port 66′ and an outlet port 68′ throughwhich the liquid coolant comes in and goes out, respectively. Theinterior passageway 63 functions as the liquid coolant circulatingpassageway of the heat exchanging device according to this embodiment.The heat generated from the elements 60 and 61 is collected at the heatsink 58′ and is transferred to the liquid coolant circulating throughthe interior passageway 63 to then be exhausted outside the heatdissipation device.

[0058] As described above, the heat exchanging devices shown in FIGS. 5Aand 5B and FIG. 6 adopt a cooling method in which the heat generatedfrom the heat-producing elements 60 and 61 of the power supply 22 iscollected at aluminum heat sinks 58 and 58′ to then be exhausted, thatis, cooled at a time, rather than cooled separately, thereby improvingthe cooling capacity and simplifying the configuration.

[0059]FIG. 7 shows still another embodiment of a heat exchanging devicefor use in a power supply. Referring to FIG. 7A, the heat exchangingdevice according to this embodiment includes a hermetic container 210installed to surround the power supply 22. A liquid coolant C′ containedin the hermetic container 210. The liquid coolant C′ is in directcontact with the power supply 22 so as to be capable of exchanging heat.Thus, in this embodiment, an insulating oil is used as the liquidcoolant C′ circulating between the heat dissipation device and the heatexchanging device for insulation between the liquid coolant C′ and thepower supply 22. A coolant refilling opening 211 and a cap 212, forrefilling the liquid coolant C′, that is, the insulating oil, areprovided on the top portion of the hermetic container 210. An inlet port216 and an outlet port 218 through which the liquid coolant C′ comes inand goes out, are formed on the side wall of the hermetic container 210.Preferably, the inlet port 216 is formed at the lower portion of theside wall and the outlet port 218 is formed at the upper portion of theside wall. Thus, the liquid coolant C′ which comes into the hermeticcontainer 210 through the inlet port 216 gets warmer while contactingthe power supply 22, and the warmed liquid coolant C′ is elevated tothen be exhausted through the outlet port 218. The circulation of theliquid coolant C′ is more smoothly performed by thermal convection ofthe liquid coolant C′. Also, the inlet port 216 and the outlet port 218may be disposed at opposite side walls of the hermetic container 210. Asdescribed above, according to this embodiment, the insulating oil isused as the liquid coolant C′, which is in direct contact with the powersupply 22, thereby insulating the power supply 22 and ensuring a coolingeffect.

[0060]FIG. 7B shows still another embodiment of a heat exchanging devicefor use in a power supply. Referring to FIG. 7B, the heat exchangingdevice according to this embodiment includes a hermetic container 220installed to surround the power supply 22, like in the embodiment shownin FIG. 7A. An insulating oil 223 is contained inside the hermeticcontainer 220 as high as it contacts an upper wall of the hermeticcontainer 220. The insulating oil 223 is in direct contact with thepower supply 22 so as to be capable of exchanging heat. A cooling plate230 heat-exchangeably contacts with the hermetic container 220 at itsouter top surface. A silicon heat pad 225 having a high heatconductivity may be inserted between the cooling plate 230 and the outertop surface of the hermetic container 220. A long, U-shaped channel 232is provided on the bottom surface of the cooling plate 230. A U-shapedconduit 234 is fitted into the channel 232 and heat-exchangeablycontacts with the cooling plate 230. To this end, a heat bond may beinterposed between the inner surface of the channel 232 and the outersurface of the U-shaped conduit 234. The bottom of the U-shaped conduit234 is formed flatly so as to be securely in contact with the outer topsurface of the hermetic container 220. The opposite ends of the U-shapedconduit 234 form an inlet port 236 and an outlet port 238 of the heatexchanging device. The U-shaped conduit 234 functions as a liquidcoolant circulating passageway of the heat exchanging device accordingto this embodiment. As described above, the insulating oil 223 of thisembodiment is not used as the liquid coolant circulating between theheat dissipation device and the heat exchanging device, unlike theembodiment shown in FIG. 7A. The insulating oil 223 of this embodimentabsorbs heat generated from the power supply 22 and transfers the sameto the liquid coolant flowing through the passageway formed in thecooling plate 230 securely in contact with the outer top surface of thehermetic container 220. In other words, the heat generated from thepower supply 22 is absorbed by the insulating oil 223 and the warmedinsulating oil 223 is elevated by thermal convection. Then, the heat istransferred to the cooling plate 230 through the upper wall of thehermetic container 220 and the heat pad 225. The thus-transferred heatis then transferred to the liquid coolant flowing through the U-shapedconduit 234 installed in the cooling plate 230, thereby cooling thepower supply 22. According to this embodiment, the power supply 22 canbe more effectively cooled while more securely insulating the powersupply 22.

[0061]FIGS. 8 through 10 illustrate two embodiments of heat exchangingdevices for use in a hard drive. Recently, hard drives have rapidlydeveloped in their performance, and in particular, high-speed revolutionthereof have noticeably progressed. Accordingly, the amount of heatproduced has also increased more severely. Heat-producing portions of ahard drive are mainly rotary portions or a microprocessor portion. Inparticular, the rise in the temperature is the most severe at the rotaryportions.

[0062] The heat exchanging device shown in FIG. 8 can be used forcooling a general hard drive 24 mounted in a computer. As shown, theheat exchanging device of this embodiment includes a cooling plate 126in heat exchangeably contact with the bottom surface of the hard drive24. Two parallel channels 127 are spaced apart from each other on onesurface of the cooling plate 126, that is, a surface in heatexchangeably contact with the bottom surface of the hard drive 24 forheat exchange. A U-shaped conduit 128 is fitted into the channels 127and heat-exchangeably contacts with the cooling plate 126. To this end,a heat bond may be interposed between the inner surface of the channels127 and the outer surface of the U-shaped conduit 128. The opposite endsof the U-shaped conduit 128 form an inlet port 129 and an outlet port130 of the heat exchanging device. The top surface of the U-shapedconduit 128 is formed flatly so as to be securely in contact with thebottom surface of the hard drive 24. The U-shaped conduit 128 functionsas the liquid coolant circulating passageway of the heat exchangingdevice according to this embodiment. Also, a silicon heat pad 124 havinghigh heat conductivity may be inserted between the cooling plate 126 andthe bottom surface of the hard drive 24. The heat pad 124 allows theheat produced from the hard drive 24 to be easily transferred to thecooling plate 126. Thus, the heat produced at the hard drive 24 istransferred to the cooling plate 126 through the heat pad 124 and thentransferred to the liquid coolant flowing through the U-shaped conduit128 installed in the cooling plate 126, thereby cooling the hard drive24.

[0063] Heat exchanging devices shown in FIGS. 9 and 10 can be used forcooling the hard drive 24 capable of swapping to be installed in acomputer so as to be replaceable. Referring to FIG. 9, the heatexchanging device of this embodiment includes a heat collecting plate152 in heat exchangeably contact with the bottom surface of the harddrive 24 so as to be capable of exchange heat. The heat collecting plate152 is preferably formed of a material having high heat conductivity,e.g., copper. A silicon heat pad 154 having a high heat conductivity isinserted between the heat collecting plate 152 and the bottom surface ofthe hard drive 24 to allow the heat generated at the hard drive 24 to beeasily transferred to the heat collecting plate 152. The hard drive 24and the heat collecting plate 152 can be securely combined by threadholes 155 and 155′ provided at the respective lateral surfaces andtightening threads 158 tightened with the thread holes 155 and 155′. Ahandle 153 for facilitating replacement of the hard drive 24 is providedat one end of the heat collecting plate 152. The heat exchanging deviceincludes a cooling plate 156 in heat exchangeably contact with thebottom surface of the heat collecting plate 152. A long, U-shapedchannel 157 is provided on the bottom surface of the cooling plate 156.A U-shaped conduit 148 is fitted into the channel 157 andheat-exchangeably contacts with the cooling plate 156. To this end, aheat bond may be interposed between the inner surface of the channel 157and the outer surface of the U-shaped conduit 148. The opposite ends ofthe U-shaped conduit 148 form an inlet port 149 and an outlet port 150of the heat exchanging device. The U-shaped conduit 148 functions as aliquid coolant circulating passageway of the heat exchanging deviceaccording to this embodiment. As described above, the heat generatedfrom the hard drive 24 is transferred to the heat collecting plate 152through the heat pad 154 and then transferred to the liquid coolantflowing through the U-shaped conduit 148 installed in the cooling plate156 securely in contact with the heat collecting plate 152, therebycooling the hard drive 24.

[0064] Referring to FIG. 10, the cooling plate 156 is installed on theinterior bottom of a slot 25 for mounting the hard drive 24 provided ina computer so as to be replaceable. Thus, if the combined structure ofthe hard drive 24 and the heat collecting plate 152 is fitted into theslot 25, the bottom surface of the heat collecting plate 152 is broughtinto heat exchangeably contact with the top surface of the cooling plate156. Here, the handle 153 provided at the heat collecting plate 152makes the combined structure of the hard drive 24 and the heatcollecting plate 152 easily detachable from the slot 25. A plate spring159 having one end fixed is installed on the slot 25. The plate spring159 presses the top surface of the hard drive 24 by its elasticity whenthe combined structure is inserted into the slot 25, thereby making thebottom surface of the heat collecting plate 152 more securely contactwith the top surface of the cooling plate 156. Thus, the heatconductivity between the heat collecting plate 152 and the cooling plate156 is increased. The plate spring 159 is bent so as to increase thecontact portions with the top surface of the hard drive 24, to achievebalancing at pressure.

[0065]FIGS. 11 and 12 illustrate preferred embodiments of heatexchanging devices for use in a CPU. As shown, the heat exchangingdevice 140 includes a cooling plate 131. A passageway 136 through whicha liquid coolant passes is provided on the inner surface 132 of thecooling plate 131. An inlet port 138 and an outlet port 139 throughwhich the liquid coolant comes in and goes out, are provided at theopposite ends of the passageway 136. The passageway 136 is formed by arectangular recess formed on the inner surface 132 and divider walls 137installed in the interior of the rectangular recess. The divider walls137 extend across the rectangular recess about two-thirds of the wayfrom one recess wall to an opposite recess wall. One or more dividerwalls may be installed. In the case where two or more divider walls 137are installed, a divider wall adjacent to a selected divider wallextends from the opposite recess wall in order to make the passagewayserpentine. The serpentine passageway 136 allows sufficient heattransfer by making the flow path of the liquid coolant longer. Atemperature sensor 142 for controlling the temperature of a CPU may beinstalled at one side of the cooling plate 131. The speed of the fan canbe adjusted according to the temperature detected by the temperaturesensor 142. Thus, when the temperature excessively rises, the system canbe made to stop operating for safety and a warning message can beissued. Also, the temperature detected by the temperature sensor 142 canbe displayed to be notified to a user.

[0066] The heat exchanging device 140 includes a bottom plate 134 havingone surface being securely in contact with the inner surface 132 of thecooling plate 131 for hermetically sealing the liquid coolant. Thebottom plate 134 is preferably formed of copper having a high heatconductivity. The other surface of the bottom plate 134heat-exchangeably contacts with the surface of the CPU. Thread holes 133and 133′ are provided at four edges of the cooling plate 131 and thebottom plate 134, respectively, so that the cooling plate 131 and thebottom plate 134 are securely tightened with each other by tighteningthreads 135. Preferably, a heat pad 141 is inserted between the innersurface 132 of the cooling plate 131 and the bottom plate 134 along theperiphery of the recess in order to prevent leakage and enhance the heatconductivity.

[0067]FIGS. 13 through 16B illustrate means for securely contacting heatexchanging devices according to the above-described embodiments with thesurface of a CPU.

[0068] The means illustrated in FIGS. 13, 14A and 14B can be used forsecurely contacting the heat exchanging devices according to theabove-described embodiments with a socket type CPU. As shown,projections 169 are provided on at least two facing lateral sides of aCPU socket 27 on which a CPU 28 is mounted. The securely contactingmeans used for the CPU 28 includes a crossed compression plate 160installed on the cooling plate 131 and a fastening thread 166 forsecurely contacting the bottom plate 134 with the surface of the CPU 28by pressing the top surface of the cooling plate 131. A thread hole 162to which the fastening thread 166 is engaged is provided in the centerof the compression plate 160. Two facing ends of the compression plate160 are bent downward, and locking openings 164 locked with theprojections 169 are formed at the bent ends. Locking openings 164, equalin number to the projections 169, here three, are preferably formed ateach of the bent ends. Also, a thread center maintaining groove 145 formaintaining the center of the fastening thread 166 is provided in thecenter on the cooling plate 131. An inlet port 138 and an outlet port139 of the heat exchanging device 140 protrude upward on the coolingplate 131 in order to avoid interference with the compression plate 160.In a state in which the compression plate 160 is installed on the heatexchanging device 140 and the locking opening 164 is locked with theprojection 169, the fastening thread 166 is fastened, the fasteningthread 166 presses the heat exchanging device 140 to then be broughtsecurely into contact with the surface of the CPU 28. Thus, the bottomplate 134 of the heat exchanging device 140 can be more securely incontact with the surface of the CPU 28.

[0069] Rotation preventing grooves 144 and rotation preventing ribs 167are provided for preventing the heat exchanging device 140 from rotatingwhen the fastening thread 166 is fastened. The rotation preventinggrooves 144 are vertically formed on at least one of four lateralsurfaces of the cooling plate 131, preferably, one on each lateralsurface of the cooling plate 131. The rotation preventing ribs 167 areprovided on the compression plate 160 to be disposed at locationscorresponding to the rotation preventing grooves 144. The rotationpreventing ribs 167 protrude downward from the compression plate 160 soas to be fitted into the rotation preventing grooves 144 when thecompression plate 160 is installed in the heat exchanging device 140.

[0070] The means illustrated in FIGS. 15, 16A and 16B can be used forsecurely contacting the heat exchanging device shown in FIG. 11 with aslot type CPU. As shown, a slot type CPU 28′ includes an outer plate 29made of aluminum and a plurality of first through holes 181 are formedon the outer plate 29. The securely contacting means for use in the CPU28′ includes fasteners 177 for pressing the compression plate 170installed to be in contact with the surface of the cooling plate 131 andthe heat exchanging device 140.

[0071] A rectangular opening 172 is formed in the central portion of thecompression plate 170. The opening 172 allows the compression plate 170to be installed on the heat exchanging device 140 without beinginterfered by the inlet port 138 and the outlet port 139. Also, aprotruding surface 146 protruding a predetermined height, preferablyequal to the thickness of the compression plate 170, is provided on thecooling plate 131. The shape and size of the protruding 146 aredetermined so as to be fitted into the opening 172 when the compressionplate 170 is combined with the heat exchanging device 140. Thus, whenthe heat exchanging device 140 and the compression plate 170 areinstalled in the CPU 28′, the heat exchanging device 140 is not movedseparately from the compression plate 170, thereby facilitating theinstallation. Such configuration is advantageously used for installingthe heat exchanging device 140 on the lateral side of the CPU 28′ whichis disposed upright.

[0072] A plurality of second through holes 176 corresponding to thefirst through holes 181 are provided at four edges of the compressionplate 170. The fasteners 177 are inserted into the first through holes181 and also inserted into the second through holes 176 corresponding tothe first through holes 181. One end 178 of each fastener 177 is crookedso as to be locked with the inner surface of the outer plate 29 of theCPU 28′, and each tightening nut 180 is engaged with the other end 179of the fastener 177. If the tightening nut 180 is tightened, thecompression plate 170 presses the top surface of the cooling plate 131to bring the bottom plate 134 securely into contact with the surface ofthe CPU 28′, that is, the outer surface of the outer plate 29. Thus, thebottom plate 134 of the heat exchanging device 140 can be more securelyin contact with the surface of the CPU 28′.

[0073]FIGS. 17 and 18 illustrate preferred embodiments of a heatexchanging device 190 for use in a memory. As shown, the heat exchangingdevice 190 includes a first cooling plate 191 and a second cooling plate192 in heat exchangeably contact with both sides of a memory 32. Atleast two first connecting projections 194 are provided lengthwise onthe inner surface of the first cooling plate 191, that is, on thesurface facing the second cooling plate 192 and are spaced apredetermined distance apart from each other. The first connectingprojections 194 have first conduit insertion holes 195 piercinglengthwise so that a conduit 198 having a long rod shape is insertedthere through. Also, second connecting projections 194′ inserted betweenthe first connecting projections 194 to then be engaged, are provided onthe inner surface of the second cooling plate 192, that is, on thesurface facing the first cooling plate 191. The second connectingprojections 194′ also have second conduit insertion holes 195′ piercinglengthwise so that the conduit 198 is inserted there through. In a statein which the first cooling plate 191 is combined with the second coolingplate 192 so that the first connecting projections 194 and the secondconnecting projections 194′ are engaged, the conduit 198 is insertedinto the first and second conduit insertion holes 195 and 195′. Here, atorsion spring 197 is fitted along the periphery of the conduit 198. Thetorsion spring 197 is interposed between the first cooling plate 191 andthe second cooling plate 192 to apply elastic force thereto so that theinner surface of each of the first and second cooling plates 191 and 192is brought securely into contact with both sides of the memory 32.

[0074] A heat bond is interposed between the inner surface of the firstconduit insertion hole 195 piercing in the first connecting projections194 and the outer surface of the conduit 198 so that the conduit 198 isfixed to the first cooling plate 191. However, the second cooling plate192 can rotate freely about the conduit 198. Thus, while preventing thefirst and second cooling plates 191 and 192 from moving lengthwise withrespect to the conduit 198, the action of the torsion spring 197 is notinterfered.

[0075] The opposite ends of the conduit 198 form an inlet port 199 andan outlet port 200 through which the liquid coolant comes in and goesout. Thus, the conduit 198 functions as the liquid coolant circulatingpassageway of the heat exchanging device 190 according to thisembodiment. The heat generated from the memory 32 is transferred to thefirst and second cooling plates 191 and 192 and then transferred to theliquid coolant flowing through the conduit 198, thereby cooling thememory 32. The above-described heat exchanging device 190 in which theliquid coolant circulation path is positioned at the upper portion ofthe memory 32, is particularly useful in the case where the distancebetween each of a plurality of neighboring memories 32 is small.

[0076]FIGS. 19 and 20 show two industrial computers 110 and 110′ eachhaving cooling apparatus according to the present invention incorporatedtherein. Referring to FIG. 19, the industrial computer 110 has a rackmount case 112. Inlet vents 114 are formed on one side wall of the rackmount case 112. Outlet vents are formed on the other side wall of therack mount case 112 to be spaced a predetermined distance apart from theinlet vents 114. The two side walls may meet at an angle and may beperpendicular to each other. The opposite ends of the heat dissipationdevice 36 are positioned adjacent to the inlet vents 114 and the outletvents, respectively. The positioning of the inlet vents 114 and theoutlet vents allows ambient air to flow freely through the heatdissipation device 36 without interference from vertically adjacentcases of computers mounted on the same rack. As shown, a fan 116 ispositioned adjacent to the outlet vents opposite to the inlet vents 114.Alternatively, the fan 116 itself may form outlet vents. A separatingwall 118 is installed inside the case 112, and the separating wall 118isolates components of the industrial computer 110 from the flow ofambient air passing through the heat dissipation device 36. Thus, evenif the industrial computer 110 is used under inferior circumstances,external air is not induced to the components, thereby preventing thecomponents from being contaminated due to foreign matter such as dust.

[0077]FIG. 20 is similar to FIG. 19 but shows a different type of rackmount industrial computer 110′. The computer 110′ has a rack mount case112′. In the industrial computer 110′, inlet vents 114′ and the fan 116are located at opposite side walls of the case 112′ rather thanintersecting side walls shown in FIG. 19. Opposite separating walls 118′isolate components of the computer 110′ from the flow of ambient airpassing through the heat dissipation device 36. In FIGS. 19 and 20,radiating fins are preferably oriented horizontally, rather thanvertically as in FIG. 4A. Arrows shown in FIGS. 19 and 20 indicate thedirections of the flow of ambient air passing through the heatdissipation device 36.

[0078]FIG. 21 is a partly cut-away perspective view of a personalcomputer having a cooling apparatus according to still anotherembodiment of the present invention and FIG. 22 is a schematic diagramof the structure of the cooling apparatus installed in the personalcomputer shown in FIG. 21.

[0079] Referring to FIGS. 21 and 22, a reservoir 638 is installed insidea tower case 604 separately from a heat dissipation device 636, anincreased pressure of water can be formed at normal times, and aninduction pump 652 and a discharge pump 654 are separately provided toallow a pumping operation even if malfunction occurs to either part.

[0080] Also, the tower case 604 has a heat dissipation device 636installed in the place of a conventional CD-ROM upward with respect tothe tower case 604, and an upper housing 614 having an air inlet opening618 and an air outlet opening 620.

[0081] In the upper housing 614, a separation wall 612 is installedbetween the heat dissipation device 636 and the heat-producingcomponents in order to protect the components installed inside theinterior space from being contaminated due to foreign matter such asdust.

[0082] In particular, the upper housing 614 includes each two pairs ofair inlet openings 618 a and 618 b and air outlet openings 620 a and 620b so that some of air passed through one air inlet opening 618 b isexhausted to the air outlet openings 620 b by the heat dissipationdevice 636, e.g., a Louver fin cooler, and the other of air passedthrough the other air inlet opening 618 a is exhausted the air outletopenings 620 b through a power supply 622 by the heat dissipation device636. A fan 650 for forcibly causing the flow of air is provided in eachof the air inlet openings 618 a and 618 b and the air outlet openings620 a and 620 b.

[0083] Here, the air exhausted by the power supply 622 can be applied tothe fan 650 installed in the conventional power supply 622.

[0084] Thus, according to another embodiment of the present invention, aheat exchanging device having a passageway extending between an inletport and an outlet port is installed in each heat-producing component.The passageway heat-exchangeably contacts with the heat-producingcomponents, so that liquid coolant C circulates through the passagewayin order to carry heat away from the components.

[0085] In other words, the coolant C stored in the reservoir 638 isinduced by the discharge pump 654 and circulates consecutively throughthe second conduit 648, the memory 32, the microprocessor chip 30 andthe heat exchanging devices of the CPU. Subsequently, the coolant C iscooled while passing through the heat dissipation device 636, passesthrough the first conduit 646 and circulates back to the reservoir 638through the induction pump 652. Small arrows shown in FIG. 22 indicatecirculation paths of the coolant C.

[0086] The circulation paths of the coolant C may be disposed in adirection opposite to that described above. Also, the inlet anddischarge pumps may be disposed in the first and second conduits.

[0087] Thus, the coolant C can form an increased pressure of water by adifference in the pressure of liquid formed by the discharge pump 654and the induction pump 652. Also, a pumping operation can be performedeven if malfunction occurs to either part, thereby preventingdeterioration of a computer.

[0088] The tower case 604 has a heat dissipation device 636 installed inthe place of a conventional CD-ROM upward with respect to the tower case604 to be easily adopted to the conventional tower case. Also, the airinlet opening 618 is separately provided. Some of the air having passedthrough the air inlet openings 618 a and 618 b is exhausted to the heatdissipation device 636 and the other air is exhausted to the powersupply 622. Thus, the fan 650 of the conventional power supply 622 canbe utilized as it is. The fan 650 is installed at each of the air inletopening 618 and the air outlet opening 620, thereby maximizing the heatdissipation efficiency.

[0089] In other words, in order to maximize heat dissipation, one sideair is induced from the upper portion of the tower case 604 to then beexhausted upward and the other side air is induced from the upperportion of the tower case 604 to then be exhausted rearward.

[0090] The fan 650 has a separate controller (not shown) to adjust thenumber of revolutions of the fan 650 according to the ambientcircumstances, that is, into a quite mode, a medium mode and a max mode.

[0091] The adjustment of the number of revolutions of the fan 650 isdone manually according to user's switching or automatically accordingto the temperature set by a user.

[0092] A safety valve 655 for exhausting gas outside during dilation ofthe internal pressure of the reservoir 638 and adjusting the pressure,is installed at an upper end of the reservoir 638.

[0093] Thus, the gas generated due to erosion or an increase intemperature of conduits or reservoir can be exhausted outside.

[0094] As shown in FIG. 22, a coolant entrance 657 which can be openedor closed by a screw or cork is formed at the topmost end of thepassageway, that is at an upper end of the heat dissipation device 636,so as to facilitate refilling or discharge of the liquid coolant C.Also, a large coolant entrance 657 which can be opened or closed by ascrew or cork is formed at the lowermost end of the passageway, that isat a bottom of the reservoir 638, so as to facilitate refilling ordischarge of the liquid coolant C.

[0095] Thus, when old and useless coolant C is discharged, the coolantentrances 657 are both opened so that the coolant C can be fastdischarged to the reservoir 638. In order to refill new coolant, thecoolant entrance 657 provided at the upper end of the heat dissipationdevice 636 is closed, the computer is overturned so that the bottom ofthe reservoir 638 faces upward, and a large amount of liquid coolant Ccan be injected into the reservoir 638 through the coolant entrance 657provided at the bottom of the reservoir 638.

[0096] At normal times, liquid coolant C can be refilled little bylittle through the coolant entrance 657 formed at the upper end of theheat dissipation device 636.

[0097] The reservoir 638 is formed of a transparent material so as toallow a user to check the amount of liquid coolant C stored therein andmay be provided with an alarm device of warning the time of refilling ofthe coolant C so as to inform the user of the shortage of the coolant.

[0098] Additionally, in the event that cooling is not performed properlydue to several causes in the cooling system, resulting in an abnormalincrease in the temperature of the computer, there may be provided acontroller for detecting abnormality by means of a sensor, notifying auser of the abnormality through lighting or alarming, and automaticallyinterrupting the operation of the computer in a predetermined time,e.g., in approximately 2 minutes if the user takes proper steps.

[0099] The power for the induction pump 652 and the discharge pump 654can be supplied from the power supply 622 without using a separate powersupply for pumping, thereby reducing the cost, prolonging the life spanof the product and satisfying the power/frequency standards.

[0100] An inverter having a converter for converting the conventional DCsupplied from the power supply 622 into an easily driven AC may befurther provided.

[0101]FIG. 23 is a fragmentary perspective view of a personal computerhaving a cooling apparatus according to still another embodiment of thepresent invention.

[0102] Referring to FIG. 23, a heat dissipation device 736 is installedupright at one side wall of a tower case 604, an air inlet opening 718is formed at a position next to the lower side wall of the heatdissipation device 736, and an air outlet opening 720 has a side housing714 having a separation wall 712 so as to utilize the air outlet opening720 having a fan 750 of the conventional power supply 722.

[0103] Also, the side housing 714 includes an intermediate fan 721having a duct 719 for forcibly inducing the air having passed throughthe air inlet opening 718 to be guided to the power supply 722.

[0104] Thus, as indicated by arrows shown in FIG. 23, the air passesthrough the air inlet opening 718 formed at the lower portion of thetower case 704 and rises along the separation wall 712 to reach theintermediate fan 721 via the heat dissipation device 736. Then, the airforcibly passes through the power supply 722 by means of theintermediate fan 721 to then be exhausted to the air outlet opening 720by means of the fan 750 of the power supply 722.

[0105] Although the preferred embodiments of the invention have beenillustrated and described herein, it is intended to be understood bythose skilled in the art that various modifications and omissions inform and detail may be made without departing from the spirit and scopeof the invention as defined by the appended claims.

[0106] As described above, according to the present invention, sinceheat-producing components are cooled by a liquid coolant circulatingthrough a heat exchanging device installed to be securely in contactwith the heat-producing components, the cooling capacity is enhancedcompared to the conventional air cooling system. Also, since the flow ofambient air for cooling the warmed liquid coolant is isolated from theheat-producing components, internal contamination of a computer due toinduction of dust can be prevented. Thus, the life span of a high-pricedcomputer can be prolonged even under inferior circumstances and thedefects thereof can be reduced. Also, in the case where the flow ofambient air is produced by natural convection, the noise due to use of afan is not generated. In the case of using a fan, the fan is operated ata level of 70% rated power to prolong the life span of the fan andreduce the noise generated by the operation of the fan, thereby makingagreeable working circumstances.

What is claimed is:
 1. A computer having a housing defining an interiorspace and at least one heat-producing component installed inside thehousing, comprising: a heat exchanging device in heat exchangeablycontact with the heat-producing component and having a passagewayextending between an inlet port and an outlet port; a heat dissipationdevice having a reservoir for storing a liquid coolant having an inletopening and an outlet opening spaced a predetermined distance apart fromthe inlet opening, and a plurality of radiating fins installed on theouter surface of the reservoir so as to be capable of exchanging heatwith the reservoir; a first conduit extending between the outlet port ofthe heat exchanging device and the inlet opening of the reservoir; asecond conduit extending between the outlet opening of the reservoir andthe inlet port of the heat exchanging device; a pump for pumping theliquid coolant out of the reservoir through the outlet opening, throughthe second conduit, the passageway and the first conduit, and back intothe reservoir through the inlet opening; and a separating wallseparating the heat dissipation device from the interior space toisolate the heat-producing component from the flow of ambient air. 2.The computer according to claim 1, wherein the housing is a tower case,and includes a subhousing mounted on the bottom wall thereof, the heatdissipation device being mounted inside the subhousing, the subhousinghaving an inlet vent and an outlet vent formed adjacent to the oppositeends of the heat dissipation device.
 3. The computer according to claim1, wherein the housing is a tower case, and wherein the separating wallis installed inside the tower case to be spaced apart from one of thebottom wall and side wall of the tower case, the heat dissipation deviceis mounted between the separating wall and one of the bottom wall andthe side walls of the tower case, and an inlet vent and an outlet ventare formed adjacent to the opposite ends of the heat dissipation device.4. The computer according to claim 1, wherein the housing is a rackmounting case, and wherein an inlet vent and an outlet vent are formedat side walls of the case to be spaced apart from each other, and theopposite ends of the heat dissipation device are positioned adjacent tothe inlet vent and the outlet vent.
 5. The computer according to claim1, further comprising a fan disposed adjacent to one end of the heatdissipation device and in communication with ambient air, for compellingthe ambient air to flow through the radiating fins to exhaust the heatfrom the liquid coolant stored in the reservoir, the fan being isolatedfrom the interior space by the separating wall.
 6. The computeraccording to claim 1, wherein at least one divider wall extendingone-end inner wall of the reservoir and the end thereof is spaced fromthe opposite inner wall of the reservoir is installed inside thereservoir to elongate the path of the flow of the liquid coolant.
 7. Thecomputer according to claim 1, wherein the heat-producing component is apower supply having a plurality of heat-producing elements, wherein theheat exchanging device includes a heat sink on which the heat-producingelements are installed and which has a channel provided at each sidethereof, and a U-shaped conduit fitted into the channel to heatexchangeably contact with the heat sink and having opposite ends formingthe inlet port and the outlet port, and wherein the passageway of theheat exchanging device is formed by the U-shaped conduit.
 8. Thecomputer according to claim 1, wherein the heat-producing component is apower supply having a plurality of heat-producing elements, and whereinthe heat exchanging device includes a heat sink on which theheat-producing elements are mounted and which has the passageway throughwhich the liquid coolant passes, being formed inside the heat sink, anda conduit fitted into the opposite ends of the passageway forming theinlet port and the outlet port.
 9. The computer according to claim 1,wherein the heat-producing component is a power supply having aplurality of heat-producing elements, wherein the heat exchanging deviceincludes a hermetic container installed to surround the power supply andcontains an insulating oil which is in direct contact with the powersupply, and wherein the inlet port and the outlet port are formed at theside walls of the hermetic container and the insulating oil functions asthe liquid coolant.
 10. The computer according to claim 1, wherein theheat-producing component is a power supply having a plurality ofheat-producing elements, wherein the heat exchanging device includes ahermetic container installed to surround the power supply and containsan insulating oil which is in direct contact with the power supply, acooling plate being in heat exchangeably contact with the outer topsurface of the hermetic container and having a U-shaped channel formedat one side being securely in contact with the hermetic container, and aU-shaped conduit fitted into the U-shaped channel, having a flat bottomso as to be securely in contact with the outer top surface of thehermetic container and having opposite ends forming the inlet port andthe outlet port, and wherein the passageway of the heat exchangingdevice is formed by the U-shaped conduit.
 11. The computer according toclaim 1, wherein the heat-producing component is a hard drive, whereinthe heat exchanging device includes a cooling plate heat-exchangeablycontacting with the bottom surface of the hard drive and having a pairof channels spaced apart from each other on one surface being securelyin contact with the hard drive, and a U-shaped conduit fitted into thepair of channels, having a flat top surface so as to be securely incontact with the bottom surface of the hard drive and having oppositeends forming the inlet port and the outlet port, and wherein thepassageway of the heat exchanging device is formed by the U-shapedconduit.
 12. The computer according to claim 1, wherein theheat-producing component is a swapping type hard drive replaceablymounted in a slot provided in the computer, wherein the heat exchangingdevice includes a heat collecting plate in heat exchangeably contactwith the bottom surface of the hard drive, a cooling plate installed onthe inner bottom of the slot, in heat exchangeably contact with thebottom surface of the heat collecting plate when the hard drive and theheat collecting plate are inserted into the slot and having a U-shapedchannel on its bottom surface, a U-shaped conduit fitted into theU-shaped channel and having opposite ends forming the inlet port and theoutlet port, and a plate spring having one end fixed installed on theslot, applying elasticity to the top surface of the hard drive to makethe bottom surface of the heat collecting plate securely contact withthe top surface of the cooling plate, and wherein the passageway of theheat exchanging device is formed by the U-shaped conduit.
 13. Thecomputer according to claim 1, wherein the heat-producing component is acentral processing unit (CPU), and wherein the heat exchanging deviceincludes a cooling plate having an inner surface on which the passagewayis formed to be serpentine and an outer surface on which the inlet portand the outlet port protrude, and a bottom plate having one surfacebeing in liquid tightly contact with the inner surface of the coolingplate and the other surface heat-exchangeably contacting with thesurface of the CPU.
 14. The computer according to claim 13, wherein atemperature sensor for controlling the temperature of the CPU isinstalled at one side of the cooling plate and the speed of the fan isadjusted according to the temperature detected by the temperature sensorand when the temperature exceeds a predetermined temperature, the systemis configured to stop operating to issue a warning message.
 15. Thecomputer according to claim 13, wherein the CPU is a socket type CPUconnected with a CPU socket having projections provided on at least twofacing lateral sides, and wherein the heat exchanging device furtherincludes a securely contacting means having a crossed compression plateinstalled on the cooling plate and having two facing ends bent downward,a thread hole formed in the center thereof and locking openings lockedwith the projections formed at the bent ends, and a fastening thread forsecurely contacting the bottom plate with the surface of the CPU bypressing the top surface of the cooling plate, and a thread centermaintaining groove for maintaining the center of the fastening thread isprovided in the center on the cooling plate.
 16. The computer accordingto claim 13, wherein the CPU is a slot type CPU having an outer plate onwhich a plurality of first throughholes, the surface of the CPU beingthe outer surface of the outer plate, and wherein the heat exchangingdevice further includes a securely contacting means having a compressionplate installed to be securely contact with the top surface of thecooling plate and having an opening formed in the central portion of thecompression plate to allow the compression plate not to be interfered bythe inlet port and the outlet port of the cooling plate, and a pluralityof second throughholes corresponding to the first throughholes, formedat the edges thereof, and fasteners inserted into the first and secondthroughholes to allow the compression plate to press the top surface ofthe cooling plate to thus securely contact the bottom plate with thesurface of the CPU.
 17. The computer according to claim 1, wherein theheat-producing component is a memory, wherein the heat exchanging deviceincludes a first cooling plate heat-exchangeably contacting with oneside of the memory, a second cooling plate heat-exchangeably contactingwith the other side of the memory, connecting projections provided onfacing surfaces of the first and second cooling plates so as to beengaged with each other and having conduit insertion holes piercinglengthwise, a conduit having a long rod shape inserted through theconduit insertion holes in a state in which the first cooling plate andthe second cooling plate are connected and having opposite ends formingthe inlet port and the outlet port and a torsion spring interposedbetween the first cooling plate and the second cooling plate to applyelastic force such that the first and second cooling plates are broughtsecurely into contact with both sides of the memory, and wherein thepassageway of the heat exchanging device is formed by the rod-shapedconduit.
 18. The computer according to claim 1, wherein the pump isinstalled inside the reservoir, wherein an induction pump and adischarge pump are separately provided to allow a pumping operation evenif malfunction occurs to either part, a safety valve for exhausting gasoutside during dilation of the internal pressure of the reservoir andadjusting the pressure, is installed at an upper end of the reservoir,and coolant entrances which can be opened or closed by a screw or corkare formed at the topmost and lowermost ends of the passageway, so as tofacilitate refilling or discharge of the liquid coolant.
 19. Thecomputer according to claim 1, wherein the housing is a tower case, thetower case having a heat dissipation device installed in the place of aconventional CD-ROM upward with respect to the tower case, and an upperhousing having an air inlet opening and an air outlet opening to providea separation wall.
 20. The computer according to claim 19, wherein theupper housing includes each two pairs of air inlet openings and airoutlet openings so that some of air passed through one air inlet openingis exhausted to the air outlet openings by the heat dissipation device,e.g., a Louver fin cooler, and the other of air passed through the otherair inlet opening is exhausted the air outlet openings through a powersupply by the heat dissipation device.
 21. The computer according toclaim 19, wherein the fan has a separate controller to adjust the numberof revolutions thereof into a quite mode, a medium mode and a max mode,the number of revolutions of the fan is adjusted manually according touser's switching or automatically according to the temperature set by auser, the controller detecting abnormality by means of a sensor,notifying a user of the abnormality through lighting or alarming, andautomatically interrupting the operation of the computer in apredetermined time, e.g., in approximately 2 minutes if the user takesproper steps, in the event that cooling is not performed properly due toseveral causes in the cooling system, resulting in an abnormal increasein the temperature of the computer.
 22. The computer according to claim1, wherein the housing is a tower case, wherein a heat dissipationdevice is installed upright at one side wall of a tower case, an airinlet opening is formed at a position next to the lower side wall of theheat dissipation device, and an air outlet opening has a side housinghaving a separation wall so as to utilize the air outlet opening havinga fan of the conventional power supply.
 23. The computer according toclaim 22, wherein the side housing includes an intermediate fan having aduct for forcibly inducing the air having passed through the air inletopening to be guided to the power supply.
 24. The computer according toclaim 1, wherein the pump further includes an inverter having aconverter for converting the conventional DC supplied from the powersupply into an easily driven AC.
 25. A heat exchanging device used forcooling a power supply having a plurality of heat-producing elements,comprising: a heat sink on which the heat-producing elements are mountedand which has a channel provided at each side thereof; and a U-shapedconduit fitted into the channel to heat exchangeably contact with theheat sink and having opposite ends forming an inlet port and an outletport through which a liquid coolant for cooling the power supply, comesin and goes out, wherein the liquid coolant circulates through apassageway formed by the U-shaped conduit.
 26. A heat exchanging deviceused for cooling a power supply having a plurality of heat-producingelements, comprising: a heat sink on which the heat-producing elementsare mounted and which has a passageway through which a liquid coolantfor cooling the power supply, passes, provided inside thereof; and aconduit fitted into opposite ends of the passageway, forming an inletport and an outlet port through which a liquid coolant for cooling thepower supply, comes in and goes out, wherein the liquid coolantcirculates through the passageway.
 27. A heat exchanging device used forcooling a power supply having a plurality of heat-producing elements,comprising: a hermetic container installed to surround the power supplyand contains an insulating oil which is in direct contact with the powersupply; and an inlet port and an outlet port formed at the side walls ofthe hermetic container so that the insulating oil comes in and goes outtherethrough, wherein the insulating oil functions as the liquid coolantfor cooling the power supply,
 28. A heat exchanging device used forcooling a power supply having a plurality of heat-producing elements,comprising: a hermetic container installed to surround the power supplyand contains an insulating oil which is in direct contact with the powersupply; a cooling plate heat-exchangeably contacting with the outer topsurface of the hermetic container and having a U-shaped channel formedat one side being securely in contact with the hermetic container; and aU-shaped conduit fitted into the U-shaped channel, having a flat bottomso as to be securely in contact with the outer top surface of thehermetic container and having opposite ends forming an inlet port and anoutlet port, wherein the liquid coolant circulates by a passagewayformed by the U-shaped conduit.
 29. A heat exchanging device used forcooling a hard drive of a computer, comprising: a cooling plateheat-exchangeably contacting with the bottom surface of the hard driveand having a pair of channels spaced apart from one side being securelyin contact with the hard drive; and a U-shaped conduit fitted into thepair of channels, having a flat top surface so as to be securely incontact with the bottom surface of the hard drive and having oppositeends forming the inlet port and the outlet port, wherein the liquidcoolant circulates by the passageway formed by the U-shaped conduit. 30.A heat exchanging device used for cooling a swapping type hard drivereplaceably mounted in a slot provided in the computer, comprising: aheat collecting plate in heat exchangeably contact with the bottomsurface of the hard drive so as to be capable of exchange heat; acooling plate installed on the inner bottom of the slot, in heatexchangeably contact with the bottom surface of the heat collectingplate when the hard drive and the heat collecting plate are insertedinto the slot and having a U-shaped channel on its bottom surface; aU-shaped conduit fitted into the U-shaped channel and having oppositeends forming an inlet port and an outlet port; and a plate spring havingone end fixed installed on the slot, applying elasticity to the topsurface of the hard drive to make the bottom surface of the heatcollecting plate securely contact with the top surface of the coolingplate, wherein the liquid coolant circulates by a passageway formed bythe U-shaped conduit.
 31. A heat exchanging device used for cooling acentral processing unit (CPU) of a computer, comprising: a cooling platehaving an inner surface on which a passageway is formed to be serpentineand an outer surface on which an inlet port and an outlet port protrude;and a bottom plate having one surface being in liquid tightly contactwith the inner surface of the cooling plate and the other surfaceheat-exchangeably contacting with the surface of the CPU, wherein theliquid coolant circulates by the passageway.
 32. The heat exchangingdevice according to claim 31, wherein the CPU is a socket type CPUconnected with a CPU socket having projections provided on at least twofacing lateral-sides, further comprising: a securely contacting meanshaving a crossed compression plate installed on the cooling plate andhaving two facing ends bent downward, a thread hole formed in the centerthereof and locking openings locked with the projections formed at thebent ends, and a fastening thread for securely contacting the bottomplate with the surface of the CPU by pressing the top surface of thecooling plate, wherein a thread center maintaining groove formaintaining the center of the fastening thread is provided in the centeron the cooling plate.
 33. The heat exchanging device according to claim32, wherein rotation preventing grooves are vertically formed on atleast one of four lateral surfaces of the cooling plate and rotationpreventing ribs protrude downward from the compression plate to bedisposed at locations corresponding to the rotation preventing groovesso as to be fitted into the rotation preventing grooves, so that theheat exchanging device is prevented from rotating when the fasteningthread is fastened.
 34. The heat exchanging device according to claim31, wherein the CPU is a slot type CPU having an outer plate on which aplurality of first throughholes, the surface of the CPU being the outersurface of the outer plate, and the heat exchanging device furtherincluding a securely contacting means having a compression plateinstalled to be securely contact with the top surface of the coolingplate and having an opening formed in the central portion of thecompression plate to allow the compression plate not to be interfered bythe inlet port and the outlet port of the cooling plate, and a pluralityof second throughholes corresponding to the first throughholes, formedat the edges thereof, and fasteners inserted into the first and secondthroughholes to allow the compression plate to press the top surface ofthe cooling plate to thus securely contact the bottom plate with thesurface of the CPU.
 35. A heat exchanging device used for cooling amemory of a computer, comprising: a first cooling plateheat-exchangeably contacting with one side of the memory; a secondcooling plate heat-exchangeably contacting with the other side of thememory; connecting projections provided on facing surfaces of the firstand second cooling plates so as to be engaged with each other and havingconduit insertion holes piercing lengthwise; a conduit having a long rodshape inserted through the conduit insertion holes in a state in whichthe first cooling plate and the second cooling plate are connected andhaving opposite ends forming an inlet port and an outlet port; and atorsion spring interposed between the first cooling plate and the secondcooling plate to apply elastic force such that the first and secondcooling plates are brought securely into contact with both sides of thememory, wherein liquid coolant circulates by a passageway formed by therod-shaped conduit.